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SF32 Approved Vendor List

What This List Is For

The Approved Vendor List (AVL) records SiFli's component qualifications for SF32 designs. V0.3 lists passive crystals, buck inductors, NOR/NAND Flash, SD-NAND, and an LCD driver; its touch-controller sheet contains no entries. Use it to select candidates and second sources, then validate the exact part on your PCB with your firmware, enclosure, production process, and supply chain. Inclusion in the AVL does not replace product-level validation.

This page is built directly from SiFli's official AVL spreadsheet, SIFLI-MCU-AVL-认证表, version V0.3 (2026-01-21). As additional parts are qualified, the AVL may change; this page reflects the dated V0.3 release, not a live database. This review confirms only the contents of V0.3 and does not establish whether any listed part remains approved in a later AVL revision. Check the current source file before finalizing a BOM:

How to use this list

The source provides general requirements for crystals and buck inductors; the other tables primarily record individual part data. Use the stated requirements to screen additional candidates, but do not assume every listed part satisfies every general limit: source discrepancies are flagged below. Columns that are empty for every source row, such as Flash download-tool support, are omitted rather than presented as verified support. In detailed tables, a dash (—) generally means V0.3 provides no value for that field. In NOR Flash DTR-clock cells, it instead represents the source's explicit "not supported" entry; see the NOR Flash note below.

Work through a BOM decision in three passes rather than picking a part number and moving on:

  1. Shortlist against the requirement. Match capacity, voltage rail, package, and the class-level requirement (load capacitance for crystals, DCR/Isat for inductors, SDR/DTR clock for Flash) to your schematic and power budget.
  2. Check the constraints that do not show up in a datasheet headline number. Confirm temperature range versus the product's operating and storage environment, exact Manufacturer/JEDEC ID expected by firmware, and whether OTA, filesystem, or download-tool support has been exercised on that exact part rather than only on a same-family part.
  3. Validate on real hardware before committing to volume. Measure standby/active current on your own board, re-check crystal RF calibration on the final PCB and enclosure, and identify at least one second source for every single-vendor line item.

Coverage at a Glance

Table: Coverage at a Glance
Category Qualified Parts Primary Selection Criteria
48 MHz crystals 10 Load capacitance, frequency tolerance, ESR, startup time, CBANK calibration, Bluetooth frequency offset
32.768 kHz crystals 5 Load capacitance, frequency tolerance, ESR, package, operating temperature
Buck inductors 8 4.7 µH value, DCR, saturation current (Isat), rated current (Irms), SRF, 2016 package compatibility
NOR Flash 44 Capacity, voltage rail, SDR/DTR clock, Reported ID, standby/deep-power-down current
SPI-NAND Flash 18 Capacity, ECC mode, page/block geometry, golden block, standby/read/program currents
SD-NAND Flash 5 SD 2.0 compatibility, 50 MHz operation, standby current, operating temperature range
LCD drivers 1 One listed part; confirm panel timing, driver support, and interface mode before release
Touch-panel controllers 0 No entries in V0.3; confirm qualification and driver support separately

Use this summary to see which component classes V0.3 covers. Display and touch choices need particular attention because this snapshot contains only one LCD driver and no touch controllers. Confirm the selected part with SiFli and validate it in the product; later AVL inclusion does not remove that requirement.

Revision History

Table: Revision History
Version Date Author Change
V0.1 2023-12-29 yzli Initial release.
V0.2 2025-07-16 yzli Added Huilun and JWT (晶威特) 48 MHz crystals.
V0.3 2026-01-21 yzli Added UCUN NOR Flash: UC25WQ80IB, UC25IQ32A, UC25IQ64A, UC25IQ128A.

Crystals

The AVL covers 48 MHz system crystals and 32.768 kHz RTC crystals. Follow the exact SF32 device's design guide for clock-source requirements, then select against load capacitance, frequency tolerance, ESR, startup behavior, and power budget. The qualification tables below do not establish one mandatory clock configuration for every SF32 product.

48 MHz System Crystal

Requirement

Load capacitance CL ≤ 12 pF (7 pF recommended) · Frequency deviation ΔF/F0 ≤ ±10 ppm · ESR ≤ 30 Ω (22 Ω recommended)

48 MHz System Crystal Qualified Parts
Qualified P/N Vendor CL ΔF/F0 ESR Operating Temp Package Startup Time Current Adder Optimal CBANK_SEL TX Ch39 Freq Offset (−35°C / 25°C / 105°C)
E1SB48E001G00E Hosonic (鸿星) 8.8 pF −10 to +9 ppm ≤22 Ω −30°C to +85°C 2016 metric <700 µs 0 µA 0x1C9 −32 to −1 kHz / ±20 kHz / +33 to +73 kHz
SX20Y048000B31T-8.8 TKD (泰晶) 8.8 pF ±10 ppm ≤40 Ω −20°C to +75°C 2016 metric <800 µs <30 µA 0x1DC −52 to −15 kHz / ±22 kHz / +50 to +100 kHz
SX20Y048000B31T001 TKD (泰晶) 8.8 pF ±10 ppm ≤40 Ω −40°C to +85°C 2016 metric <800 µs <30 µA 0x1F7 −53 to +13 kHz / ±30 kHz / +44 to +90 kHz
CN4048M00085C822000 JWT (晶威特) 8 pF ±8 ppm ≤22 Ω −30°C to +85°C 2016 metric <700 µs 0 µA 0x195 −40 to +1 kHz / −25 to +14 kHz / +12 to +45 kHz
HS48000013 汇隆电子 8.8 pF ±10 ppm ≤22 Ω −30°C to +85°C 2016 metric <700 µs <12 µA 0x1F3 −27 to +8 kHz / −25 to +10 kHz / −1.2 to +32 kHz
SX20Y048000B81T003 TKD (泰晶) 8 pF ±10 ppm ≤40 Ω −30°C to +85°C 2016 metric <700 µs <10 µA 0x1F4 −41 to +7 kHz / −30 to +20 kHz / +5 to +57 kHz
L214S480D11-S Lucki (蓝晶) 8 pF ±10 ppm ≤30 Ω −30°C to +85°C 2016 metric <750 µs <50 µA 0x196 −38 to 0 kHz / −28 to 0 kHz / −4 to +45 kHz
8Y48090002 TXC (晶技) 8.8 pF −6 to +8 ppm ≤22 Ω −30°C to +85°C 2016 metric <700 µs <30 µA 0x1D0 −34 to −9.6 kHz / — / +27.9 to +46.1 kHz
9S48000051 惠伦晶体 8.8 pF −6 to +8 ppm ≤20 Ω −30°C to +85°C 2016 metric <700 µs <15 µA — —
CN4048M000885C822000 JWT (晶威特) 8.8 pF ±8 ppm ≤22 Ω −30°C to +85°C 2016 metric <700 µs <10 µA 0x1D0 −34 to −9.6 kHz / −25 to +10 kHz / +27.9 to +46.1 kHz

What the RF calibration columns mean

CBANK_SEL is the trim setting reported in SiFli's qualification data. TX Ch39 Freq Offset retains the source's test label and three temperature-point results. The workbook does not identify the Bluetooth mode or test frequency; do not assume this means BLE advertising channel 39 or a particular mid-band channel. Confirm the test setup and calibration procedure before comparing results or applying trim settings to your board. Three TKD rows list ESR ≤40 Ω despite the general ≤30 Ω requirement; this source discrepancy also needs confirmation.

The crystal table's additional-current figures have no documented baseline or complete test setup. They are not standalone crystal supply currents; confirm the measurement definition before comparing candidates or using the values in a system power budget.

32.768 kHz RTC Crystal

Requirement

Load capacitance CL ≤ 12.5 pF (7 pF recommended) · Frequency deviation ΔF/F0 ≤ ±20 ppm · ESR ≤ 80 kΩ (38 kΩ recommended)

32.768 kHz RTC Crystal Qualified Parts
Qualified P/N Vendor CL ΔF/F0 ESR Operating Temp Package Source Percentages; Meaning Unconfirmed (−35°C / 25°C / 105°C)
ETST00327000LE Hosonic (鸿星) 7 pF ±20 ppm ≤70 kΩ −40°C to +85°C 3215 metric 32% to 55% / 43% to 54% / 38% to 45%
SF32K32768D71T01 TKD (泰晶) 7 pF ±20 ppm ≤70 kΩ −40°C to +85°C 3215 metric 33% to 54% / 42% to 56% / 35% to 44%
X1A0001210008xx Epson (爱普生) 7 pF ±20 ppm ≤90 kΩ −40°C to +85°C 1610 metric 35% to 61% / 42% to 58% / 36% to 48%
DH2032K76807T2719002 JWT (晶威特) 7 pF ±20 ppm ≤70 kΩ −40°C to +85°C 3215 metric 43% to 60% / 45% to 59% / 37% to 48%
SF32WK32768D71T024 TKD (泰晶) 7 pF ±20 ppm ≤70 kΩ −40°C to +85°C 3215 metric 34% to 55% / 41% to 54% / 36% to 46%

The workbook reports 32.76 kHz for every part at three discrete test temperatures: −35°C, 25°C, and 105°C. This displayed precision does not establish ppm-level accuracy or continuous-temperature performance. The percentage values above appear in columns whose source header is TX_CH39_Freq_offset(KHz), although their format suggests duty-cycle measurements. Confirm their meaning with SiFli before using them as duty-cycle limits. The 105°C test point also does not extend the listed −40°C to +85°C operating range. The Epson part's listed ESR limit of 90 kΩ exceeds the general 80 kΩ requirement; retain this source discrepancy and confirm acceptance for your design.

Buck Inductors

Requirement

Inductance L = 4.7 µH ±20% · DC resistance (DCR) ≤ 0.4 Ω · Saturation current (Isat) ≥ 450 mA

Buck Inductor Qualified Parts
Qualified P/N Vendor Type Tolerance SRF DCR Isat Irms Package
WPN201610U4R7MT Sunlord Wirewound ±20% 21 MHz ≤288 mΩ 1.3 A 1.45 A 0806 (2016 metric)
WPN201610H4R7MT Sunlord Wirewound ±20% 25 MHz ≤425 mΩ 1.2 A 1.0 A 0806 (2016 metric)
HTTX20161T-4R7MDR Cyntec Wirewound ±20% — ≤250 mΩ 1.7 A 1.5 A 0806 (2016 metric)
VLS201612CX-4R7M-1 TDK Wirewound ±20% 51 MHz ≤252 mΩ 0.88 A 1.32 A 0806 (2016 metric)
CIGW201610GL4R7MLE Samsung Wirewound ±20% — ≤240 mΩ 1.4 A 1.4 A 0806 (2016 metric)
DFE201612E-4R7M=P2 Murata Wirewound ±20% — ≤252 mΩ 1.8 A 1.2 A 0806 (2016 metric)
SWAI201610H4R7M 三体微 Wirewound ±20% — ≤390 mΩ 1.3 A 1.05 A 0806 (2016 metric)
FSHJ201610-4R7M 方磁 Wirewound ±20% — ≤425 mΩ 1.1 A 0.9 A 0806 (2016 metric)

Inclusion in this table does not make the eight inductors electrically interchangeable. WPN201610H4R7MT and FSHJ201610-4R7M each have a listed maximum DCR of 425 mΩ, exceeding the general 0.4 Ω requirement. The workbook does not explain this discrepancy; confirm acceptance with SiFli rather than treating either part as meeting that limit. For every candidate, check DCR loss, Isat, Irms, SRF, footprint, height, and temperature rise against the converter's actual inductor current and operating conditions, not the whole product's average current.

NOR Flash

V0.3 lists 44 NOR Flash parts from 4 Mb to 256 Mb, grouped by capacity. The clock values describe the listed memory devices, not guaranteed operating speeds on every SF32 device or board. Check read-command support, controller limits, timing, and driver identification for your exact design. The source labels its hexadecimal identification values “Manufacture ID”; these include device-identification fields, so compare the full expected response rather than only a manufacturer byte. Use current values under documented operating conditions when calculating active and standby power.

4 Mb – 16 Mb

None of the six parts in this capacity tier support DTR mode, so only a single SDR clock column is shown.

4 Mb to 16 Mb NOR Flash Qualified Parts
Qualified P/N Vendor Capacity Voltage Temp Range Max SDR Clock Reported ID Standby Deep Power-Down Active Read Current
P25Q40SU PUYA 4 Mb 1.65–3.6 V −40°C to +85°C 85 MHz @1.8 V / 104 MHz @3.3 V 0x856013 10 µA 0.1 µA @1.8 V / 0.6 µA @3.3 V 3.5 mA @85 MHz (1.8 V) / 5 mA @85 MHz (3.3 V) / EDH: not supported
P25Q80LE PUYA 8 Mb 1.65–2.0 V −40°C to +85°C 104 MHz 0x856014 9 µA 0.1 µA 1.5 mA @85 MHz / EDH: not supported
GD25LE80E GD (GigaDevice) 8 Mb 1.65–2.0 V −40°C to +85°C 133 MHz 0xC86014 10 µA 0.2 µA 3 mA @80 MHz / EDH: not supported
UC25WQ80IB UCUN 8 Mb 1.65–3.6 V −40°C to +85°C 104 MHz 0xB36014 1.5 µA 0.5 µA 6 mA @85 MHz / EDH: not supplied
P25Q16LE PUYA 16 Mb 1.65–2.0 V −40°C to +85°C 104 MHz 0x856015 18 µA 0.1 µA 3 mA @85 MHz / EDH: not supported
GD25LE16E GD (GigaDevice) 16 Mb 1.65–2.0 V −40°C to +85°C 133 MHz 0xC86015 10 µA 0.2 µA 3 mA @80 MHz / EDH: not supported

32 Mb – 64 Mb

32 Mb to 64 Mb NOR Flash Qualified Parts
Qualified P/N Vendor Capacity Voltage Temp Range Max Clock (SDR / DTR) Reported ID Standby Deep Power-Down Active Read Current
P25Q32L PUYA 32 Mb 1.65–2.0 V −40°C to +85°C 120 MHz / — 0x856016 9 µA 0.2 µA 2 mA @85 MHz / EDH: not supported
SK25LE032 SK 32 Mb 1.65–2.0 V −40°C to +85°C 133 MHz / 80 MHz 0x257016 10 µA 0.1 µA 2 mA @80 MHz (SDR) / 2.6 mA @80 MHz (DTR)
GD25LE32E GD (GigaDevice) 32 Mb 1.65–2.0 V −40°C to +85°C 133 MHz / — 0xC86016 10 µA 0.2 µA 3 mA @80 MHz / EDH: not supported
UC25IQ32A UCUN 32 Mb 2.7–3.6 V −40°C to +85°C 133 MHz / 66 MHz 0xB34014 15 µA 1 µA 8 mA @80 MHz / EDH: not supplied
P25Q64LE PUYA 64 Mb 1.65–2.0 V −40°C to +85°C 104 MHz / — 0x856017 18 µA 0.3 µA 2 mA @85 MHz / EDH: not supported
P25Q64H PUYA 64 Mb 2.3–3.6 V −40°C to +85°C 120 MHz / — 0x856017 18 µA 0.6 µA 4 mA @85 MHz / EDH: not supported
P25Q64SH PUYA 64 Mb 2.3–3.6 V −40°C to +85°C 120 MHz / 70 MHz 0x856017 10 µA 0.3 µA 6.8 mA @85 MHz (SDR) / 9.45 mA @70 MHz (DTR)
GD25LE64E GD (GigaDevice) 64 Mb 1.65–2.0 V −40°C to +85°C 133 MHz / — 0xC86017 10 µA 0.2 µA 3 mA @80 MHz / EDH: not supported
ZB25LQ64A ZBIT 64 Mb 1.65–2.0 V −40°C to +85°C 133 MHz / 66 MHz 0x5E7017 10 µA 1 µA 4 mA @104 MHz / EDH: not supplied
BY25Q64ES BOYA 64 Mb 2.7–3.6 V −40°C to +85°C 120 MHz / — 0x684017 9 µA 0.4 µA 6 mA @80 MHz / EDH: not supported
UC25IQ64A UCUN 64 Mb 2.7–3.6 V −40°C to +85°C 133 MHz / 66 MHz 0xB34017 10 µA 1 µA 15 mA @80 MHz / EDH: not supplied

128 Mb

128 Mb NOR Flash Qualified Parts
Qualified P/N Vendor Voltage Temp Range Max Clock (SDR / DTR) Reported ID Standby Deep Power-Down Active Read Current
P25Q128L PUYA 1.65–2.0 V −40°C to +85°C 70 MHz / 43 MHz 0x856018 15 µA 0.5 µA 4.5 mA @85 MHz / EDH: not supplied
PY25Q128HA PUYA 2.7–3.6 V −40°C to +85°C 104 MHz / 66 MHz 0x852018 15 µA 1 µA 7 mA @85 MHz (SDR) / 9 mA @66 MHz (DTR)
SK25LP128 SK 1.65–2.0 V −40°C to +85°C 166 MHz / 104 MHz 0x257018 8 µA 0.1 µA 2 mA @80 MHz (SDR) / 2.6 mA @80 MHz (DTR)
GD25LQ128E GD (GigaDevice) 1.65–2.0 V −40°C to +85°C 120 MHz / — 0xC86018 35 µA 1 µA 13 mA @80 MHz / EDH: not supported
GD25Q128E GD (GigaDevice) 2.7–3.6 V −40°C to +85°C 133 MHz / — 0xC84018 14 µA 1 µA 8 mA @80 MHz / EDH: not supported
GD25F128F GD (GigaDevice) 2.7–3.6 V −40°C to +85°C 166 MHz / 104 MHz 0xC84318 16 µA 1 µA 12 mA @80 MHz / EDH: not supplied
W25Q128JW Winbond 1.7–1.95 V −40°C to +85°C 133 MHz / — 0xEF6018 10 µA 1 µA — / EDH: not supported
W25Q128JV Winbond 2.7–3.6 V −40°C to +85°C 133 MHz / — 0xEF4018 10 µA 1 µA 12 mA @104 MHz / EDH: not supported
XT25F128F XTX 2.7–3.6 V −40°C to +85°C 133 MHz / 104 MHz 0x0B4018 15 µA 1 µA 8 mA @80 MHz / EDH: not supplied
XT25Q128DW XTX 1.7–2.0 V −40°C to +85°C 108 MHz / 76 MHz 0x0B6018 12 µA 0.4 µA 9 mA @80 MHz / EDH: not supplied
FM25W128 FM 1.65–3.6 V −40°C to +85°C 50 MHz @1.8 V / 100 MHz @3.3 V (SDR only, DTR not supported) 0xA12818 5 µA 1 µA @3.3 V — / EDH: not supported
XM25QU128C XMC 1.65–1.95 V −40°C to +85°C 133 MHz / — 0x204118 18 µA 6 µA 6 mA @66 MHz / EDH: not supported
ZB25VQ128D ZBIT 2.3–3.6 V −40°C to +85°C 104 MHz / — 0x5E4018 10 µA 1 µA 4 mA @104 MHz / EDH: not supported
ZB25LQ128B ZBIT 1.65–2.0 V −40°C to +85°C 104 MHz / — 0x5E5018 9 µA 3 µA 9 mA @104 MHz / EDH: not supported
BY25Q128ES BOYA 2.7–3.6 V −40°C to +85°C 108 MHz / — 0x684018 14 µA 0.2 µA 6 mA @80 MHz / EDH: not supported
UC25IQ128A UCUN 2.7–3.6 V −40°C to +85°C 133 MHz / 66 MHz 0xB34018 15 µA 1 µA 12 mA @80 MHz / EDH: not supplied

256 Mb

256 Mb NOR Flash Qualified Parts
Qualified P/N Vendor Voltage Temp Range Max Clock (SDR / DTR) Reported ID Standby Deep Power-Down Active Read Current
W25Q256JW Winbond 1.7–1.95 V −40°C to +85°C 133 MHz / — 0xEF6019 10 µA 1 µA 8 mA @80 MHz / EDH: not supported
W25Q256JV Winbond 2.7–3.6 V −40°C to +85°C 133 MHz / — 0xEF7019 10 µA 1 µA 12 mA @104 MHz / EDH: not supported
PY25Q256HB PUYA 2.7–3.6 V −40°C to +85°C 133 MHz / 100 MHz 0x852019 20 µA 1 µA 7 mA @80 MHz (SDR) / 11.5 mA @80 MHz (DTR)
GD25LQ256D GD (GigaDevice) 1.65–2.0 V −40°C to +85°C 120 MHz / — 0xC86019 70 µA 2 µA 10 mA @80 MHz / EDH: not supported
GD25Q256E GD (GigaDevice) 2.7–3.6 V −40°C to +85°C 133 MHz / — 0xC84019 16 µA 1 µA 12 mA @80 MHz / EDH: not supported
XM25QU256C XMC 1.65–1.95 V −40°C to +85°C 133 MHz / — 0x204119 15 µA 7 µA 11 mA @66 MHz / EDH: not supported
XM25QH256C XMC 2.3–3.6 V −40°C to +85°C 133 MHz / — 0x204019 15 µA 7 µA 7 mA @66 MHz / EDH: not supported
XT25F256BW XTX 2.7–3.6 V −40°C to +85°C 104 MHz / 50 MHz 0x0B4019 15 µA 0.5 µA 8 mA @80 MHz / EDH: not supplied
DS25M4BA Dosilicon 1.65–1.95 V −40°C to +85°C 108 MHz / 80 MHz 0xE54219 15 µA 5 µA 13 mA @108 MHz / EDH: not supplied
BY25Q256FS BOYA 2.7–3.6 V −40°C to +85°C 100 MHz / 54 MHz 0x684919 28 µA 2 µA 13 mA @80 MHz / EDH: not supplied
MX25U25643G MXIC (Macronix) 1.65–2.0 V −40°C to +85°C 133 MHz / 54 MHz 0xC22539 15 µA 0.8 µA 7 mA @84 MHz / EDH: not supplied

Current and mode limits need their original conditions

These are values reported in the AVL, not independent measurements by this site. Unless explicitly marked, do not assume a value is typical or maximum, or that unstated voltage, temperature, and clock conditions match another row. Verify the component datasheet and measure your board. Read-current values originate from the source's EBH and EDH columns. A current-cell "—" means the value was not provided; a DTR-clock "—" represents the source's unsupported-mode entry. The source calls its second clock column TDR; this page uses DTR, but the exact read mode and command still require device-specific verification.

The EDH labels preserve the source's distinction between missing data and unsupported operation; they are not inferred from the clock column. P25Q128L has a source inconsistency: its maximum SDR clock is listed as 70 MHz, but its read current is specified at 85 MHz. Both values are retained; confirm the valid conditions before using them.

SPI-NAND Flash

V0.3 lists 18 SPI-NAND parts at 512 Mb and 1 Gb. They can provide file or data storage with a compatible driver and software stack; examples include FatFS, FlashDB, and LittleFS, but compatibility requires validation for the selected part. NAND page access, ECC, and bad-block management differ from direct NOR XIP access. The workbook records Golden Block as block0 for every listed part, but does not specify the guarantee conditions or which firmware routines rely on it. Confirm these assumptions against the device and SDK documentation.

For GD5F1GM7RE and GD5F1GM7UE, the source lists 2048+64 bytes per page but 128K+8K bytes per block. The spare-area figures are not consistent with a straightforward page-to-block calculation. Both values are preserved below; confirm page, block, and spare-area geometry against the exact device datasheet before configuring the driver.

512 Mb

512 Mb SPI-NAND Flash Qualified Parts
Qualified P/N Vendor Voltage Temp Range Reported ID Page / Block Size Max Rate ECC Golden Block Standby Page Read Program/Erase
F35SQA512M FORESEE 2.7–3.6 V −40°C to +85°C 0xCD7070 2048+64 B / 128K+4K 133 MHz HW 1-bit block0 10 µA 10 mA 15 mA
F35UQA512M FORESEE 1.7–1.95 V −40°C to +85°C 0xCD6060 2048+64 B / 128K+4K 104 MHz HW 1-bit block0 10 µA 10 mA 15 mA
DS35M12B Dosilicon 1.7–1.95 V −40°C to +85°C 0xE5A5E5 2048+128 B / 128K+8K 83 MHz HW 8-bit block0 10 µA 10 mA 15 mA
DS35Q12B Dosilicon 2.7–3.6 V −40°C to +85°C 0xE5F5E5 2048+128 B / 128K+8K 104 MHz HW 8-bit block0 10 µA 10 mA 15 mA

1 Gb

Table: 1 Gb SPI-NAND Flash Qualified Parts
Qualified P/N Vendor Voltage Temp Range Reported ID Page / Block Size Max Rate ECC Golden Block Standby Page Read Program/Erase
W25N01GW Winbond 1.7–1.95 V −40°C to +85°C 0xEFBA21 2048+64 B / 128K+4K 104 MHz HW 1-bit block0 10 µA 25 mA 25 mA
W25N01GV Winbond 2.7–3.6 V −40°C to +85°C 0xEFAA21 2048+64 B / 128K+4K 104 MHz HW 1-bit block0 10 µA 25 mA 25 mA
GD5F1GM7RE GD (GigaDevice) 1.7–2.0 V −40°C to +85°C 0xC881C8 2048+64 B / 128K+8K 104 MHz SDR / 80 MHz DTR HW 8-bit block0 10 µA 10 mA 10 mA
GD5F1GM7UE GD (GigaDevice) 2.7–3.6 V −40°C to +85°C 0xC891C8 2048+64 B / 128K+8K 133 MHz SDR / 104 MHz DTR HW 8-bit block0 10 µA 15 mA 15 mA
F35SQA001G FORESEE 2.7–3.6 V −40°C to +85°C 0xCD7171 2048+64 B / 128K+4K 104 MHz HW 1-bit block0 10 µA 10 mA 15 mA
HYF1GQ4IDACAE HeYangTek 1.7–1.98 V −40°C to +85°C 0xC981C9 2048+64 B / 128K+4K 80 MHz HW 4-bit block0 10 µA 5 mA —
HYF1GQ4UDACAE HeYangTek 2.7–3.6 V −40°C to +85°C 0xC921C9 2048+64 B / 128K+4K 108 MHz HW 4-bit block0 10 µA 15 mA —
XT26Q01D XTX 1.7–1.95 V −40°C to +85°C 0x0B5100 2048+128 B / 128K+8K 108 MHz HW 8-bit block0 15 µA 26 mA 28 mA / 18 mA
XT26G01C XTX 2.7–3.6 V −40°C to +85°C 0x0B3100 2048+128 B / 128K+8K 104 MHz HW 8-bit block0 180 µA 25 mA 30 mA / 25 mA
DS35M1GB Dosilicon 1.7–1.95 V −40°C to +85°C 0xE5A1E5 2048+128 B / 128K+8K 83 MHz HW 8-bit block0 10 µA 10 mA 15 mA
DS35Q1GB Dosilicon 2.7–3.6 V −40°C to +85°C 0xE5F1E5 2048+128 B / 128K+8K 104 MHz HW 8-bit block0 10 µA 10 mA 15 mA
ZB35Q01A ZBIT 2.7–3.6 V −40°C to +85°C 0x5E415E 2048+64 B / 128K+4K 80 MHz HW 8-bit block0 10 µA 10 mA 10 mA
FM25SL01 FM 1.75–1.95 V −40°C to +85°C 0xA1A5A1 2048+128 B / 128K+8K 80 MHz HW 1-bit block0 10 µA 16 mA 16 mA
TC58CYG0S3HRAIJ KIOXIA 1.7–1.95 V −40°C to +85°C 0x98D240 2048+64 B / 128K+4K 133 MHz HW 8-bit block0 30 µA 17 mA 26 mA

Before implementing Flash detection, check the JEDEC/manufacturer ID sequence in each part's datasheet. The number of ID bytes returned after opcode 0x9F varies by vendor: some return a 2-byte device ID as DID1+DID2, others a single ID byte. These differences can cause "unrecognized Flash" errors when bringing up a part from a new second source.

Source ID Read Sequences

The workbook records the following three ID-read formats. MID denotes manufacturer ID; DID, DID1, and DID2 denote device-ID fields. These are source strings, not executable transactions. Confirm opcode, dummy/address phase, returned byte count, and chip-select timing against the exact device datasheet before implementation. The hexadecimal IDs in the part tables are not all single manufacturer-ID bytes.

SPI-NAND ID Read Sequences Reported in V0.3
Parts Source Sequence
F35SQA512M, F35UQA512M, W25N01GW, W25N01GV, F35SQA001G, TC58CYG0S3HRAIJ 9F+dummy(8bit)+MID+DID1+DID2
DS35M12B, DS35Q12B, GD5F1GM7RE, GD5F1GM7UE, DS35M1GB, DS35Q1GB, FM25SL01 9F+dummy(8bit)+MID+DID
HYF1GQ4IDACAE, HYF1GQ4UDACAE, XT26Q01D, XT26G01C, ZB35Q01A 9F+00+MID+DID

SD-NAND Flash

V0.3 lists five qualified 1 Gb SD-NAND parts with an SD 2.0 interface. They are candidates for fixed storage accessed through an SD interface without a physical card slot. Confirm controller and driver compatibility for the exact part and product before selection.

SD-NAND Flash Qualified Parts
Qualified P/N Vendor Temp Range Voltage Interface Max Clock Standby Operating Current
CSNP1GCR01-BOW CS −30°C to +85°C 2.7–3.6 V SD 2.0 50 MHz 150 µA (typ) 15 mA @50 MHz (typ)
XTSD01GLGEAG XTX −30°C to +85°C 2.7–3.6 V SD 2.0 50 MHz 200 µA (max) 30 mA @50 MHz (max)
XSSD01GGAI XSS 0°C to +70°C 2.7–3.6 V SD 2.0 50 MHz 300 µA (max) 45 mA @50 MHz (max)
MKDV1GCL-AB MK −25°C to +85°C 2.7–3.6 V SD 2.0 50 MHz 50 µA (max) 28 mA @50 MHz (max)
XS26D01GACW Icthink −25°C to +85°C 2.7–3.6 V SD 2.0 50 MHz 250 µA (max) 100 mA @50 MHz (max)

XSSD01GGAI is listed for 0°C to +70°C. The other four parts extend down to −25°C or −30°C and up to +85°C; use each row's actual limits rather than assuming a shared temperature grade. Check the required margin for your product environment.

LCD Driver

V0.3 display-driver coverage

V0.3 lists one LCD driver. The V0.3 workbook is a fixed snapshot, not a link to future revisions. Absence from it does not establish lack of support; confirm an unlisted part with SiFli before production selection. The listed MIPI and QSPI interfaces belong to the display driver, not necessarily to every SF32 device. Check the selected chip's interfaces and driver support; see Graphics Overview and ePicasso GPU Architecture. The source gives the SDR rate as ?MHz, so it is unspecified, and marks DDR as unsupported.

LCD Driver Qualified Parts
Qualified P/N Vendor Resolution Type IO Voltage Interface GRAM Color Depth Max Rate (SDR / DDR)
RM69090 Raydium 368×448 AMOLED 1.65–3.3 V MIPI, QSPI Yes 16.7M colors Unspecified / not supported

Touch Panel Controller

V0.3 contains no touch-controller entries. This does not establish qualification status in later revisions or mean that a device is unsupported. For a proposed part, ask SiFli FAE or sales to confirm qualification status and driver support, supplying the exact order code and product requirements. See the contact information.

Design Review Checklist

Before freezing a schematic or BOM, review each selected AVL part against the actual product design:

  • The exact part number, package, temperature grade, and ordering suffix match the approved row or have an explicit engineering approval path.
  • Voltage range matches the SF32 IO rail, Flash rail, display rail, or power-converter rail used on the board.
  • Package, land pattern, height, and assembly constraints match the PCB library and manufacturing process.
  • Firmware can identify the part correctly, using JEDEC/manufacturer ID or an equivalent runtime probe where applicable.
  • Boot, download, OTA, filesystem, display, or touch-driver behavior has been verified on the exact component.
  • Low-power current has been measured on real hardware, not copied directly from the AVL or component datasheet.
  • Crystal frequency offset, CBANK_SEL behavior, and RF calibration are validated on the final PCB, antenna, and enclosure.
  • Flash erase/program/read timing is tested under the product's expected voltage and temperature range.
  • At least one second-source candidate is identified for high-risk BOM items such as crystals, inductors, Flash, and display panels.

This checklist is intentionally stricter than "the part appears in the AVL." The AVL narrows the search space; product release still depends on board-level evidence.

Sourcing Checklist

  • Cross-check the part number and revision suffix against the current downloadable AVL — spreadsheet snapshots (including this page) go stale as new lots are qualified.
  • For Flash parts, confirm the Manufacturer/JEDEC ID your bring-up code expects matches the exact part ordered, not just the family — some families share a marketing name but return different ID bytes.
  • For NAND, SD-NAND, and any part backing a filesystem, verify boot/download-tool support, OTA update flow, and filesystem behavior (FatFS/FlashDB/LittleFS) on real hardware — a part that reads back correctly during bring-up is not automatically validated for OTA.
  • For crystals, validate CBANK_SEL and the reported TX Ch39 frequency offset on your board. The workbook does not specify the reference layout or full measurement setup; confirm the test mode and conditions before comparing results.
  • Measure standby, deep-power-down, and active-read current on your board. The AVL does not establish the provenance or complete operating conditions of every value, so verify the datasheet and measurement conditions.
  • Confirm package and footprint match your PCB library and assembly capability, not just the electrical spec.
  • For any part not yet on this list, qualify it against the requirement row for its component class before committing it to a BOM, and consider sharing the qualification data back with SiFli.
  • Identify a second-source candidate for each single-vendor item. V0.3 lists one LCD driver and no touch controllers; confirm current availability and support rather than treating this snapshot as the latest status.
  • Re-check this list before every major BOM freeze — it is a snapshot, not a live database.

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